发明名称 |
Semiconductor package module and electric circuit assembly with the same |
摘要 |
Disclosed herein is a semiconductor package module. The semiconductor package module includes a circuit substrate having an external connection pattern; electronic components mounted on the circuit substrate; a molding structure having a structure surrounding the circuit substrate so as to seal the electronic components from the external environment; and an external connection structure of which one portion is connected to the external connection pattern and the other portion is exposed to the outside of the molding structure.
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申请公布号 |
US8581394(B2) |
申请公布日期 |
2013.11.12 |
申请号 |
US20100897842 |
申请日期 |
2010.10.05 |
申请人 |
PARK SEUNG WOOK;KWEON YOUNG DO;PARK MI JIN;SAMSUNG ELECTRO-MECHANICS CO., LTD |
发明人 |
PARK SEUNG WOOK;KWEON YOUNG DO;PARK MI JIN |
分类号 |
H01L23/34 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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