发明名称 |
Semiconductor package manufacturing method and semiconductor package |
摘要 |
According to one embodiment, there is provided a semiconductor package manufacturing method utilizing a support body in which a first layer is stacked on a second layer, the method including: a first step of forming an opening in the first layer to expose the second layer therethrough; a second step of arranging a semiconductor chip on the second layer through the opening; a third step of forming a resin portion on the first layer to cover the semiconductor chip; and a fourth step of forming a wiring structure on the resin portion so as to be electrically connected to the semiconductor chip. |
申请公布号 |
US8581421(B2) |
申请公布日期 |
2013.11.12 |
申请号 |
US201113328529 |
申请日期 |
2011.12.16 |
申请人 |
SHIMIZU NORIYOSHI;ROKUGAWA AKIO;YOSHINO HIROKAZU;SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
SHIMIZU NORIYOSHI;ROKUGAWA AKIO;YOSHINO HIROKAZU |
分类号 |
H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/48 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|