Method for manufacturing semiconductor device, semiconductor chip, and semiconductor wafer

摘要

A semiconductor wafer having a plurality of interconnect layers, includes a plurality of chip-composing portions, a dicing region separating the chip-composing portions from each other, and a plurality of inter-chip interconnects formed in the dicing region and electrically connecting adjacent ones of the chip-composing portions, wherein each of the inter-chip interconnects has a width of an intermediate portion narrower than widths of connection end portions connected to the adjacent ones of the chip-composing portions.