| 摘要 |
The present invention relates to a light emitting diode package and a manufacturing method thereof and provides a light emitting diode package and a manufacturing method thereof capable of significantly reducing manufacturing costs while maximizing heat dissipation performance by replacing a plastic housing mold or a ceramic housing mold, which surrounds a light emitting diode and plays a role as a reflector, with a metal housing mold. Disclosed is a light emitting diode package for mounting a light emitting diode chip, which comprises a lead frame including a base part providing a space for mounting a light emitting chip and a housing part laminated on one surface of the base part by being bent in the state of being connected to one end of the base part. |
