| 摘要 |
PURPOSE: A non-contact sensing module and a manufacturing method thereof are provided to reduce the thickness of PCBs(Printed Circuit Board), thereby reducing costs. CONSTITUTION: A non-contact sensing module comprises a coil PCB(20) and a main PCB(40). The coil PCB includes a reference pattern coil(21) on the top surface, a sensing pattern coil on the bottom surface, and a mounting hole in the center. The main PCB is joined to the mounting hole, arranged vertically on the top surface of the coil PCB, and electrically connected to the reference pattern coil and the sensing pattern coil. |
