发明名称 METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC COMPONENT MOUNTING DEVICE
摘要 <p>The present invention reliably installs electronic components as an electronic component installing device used for a method for sequentially attaching a plurality of top electronic components on a flat surface of bottom electronic components. For a solution, first heaters (22a-22c) independently controlled by being installed on a stage (20) demarcated by a plurality of stage parts (20a-22c) and the stage parts (20a-22c), an installing head (40) placed on the stage (20), and a second heater (22x) installed on the installing head (40) are included.</p>
申请公布号 KR20130122911(A) 申请公布日期 2013.11.11
申请号 KR20130040948 申请日期 2013.04.15
申请人 SHINKO ELECTRIC INDUSTRIES CO., LTD. 发明人 HIGASHIZAWA YOSHITADA;KOBAYASHI KOSUKE;HATAYAMA YUKINORI
分类号 H01L21/50;H01L21/60 主分类号 H01L21/50
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