发明名称 |
METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC COMPONENT MOUNTING DEVICE |
摘要 |
<p>The present invention reliably installs electronic components as an electronic component installing device used for a method for sequentially attaching a plurality of top electronic components on a flat surface of bottom electronic components. For a solution, first heaters (22a-22c) independently controlled by being installed on a stage (20) demarcated by a plurality of stage parts (20a-22c) and the stage parts (20a-22c), an installing head (40) placed on the stage (20), and a second heater (22x) installed on the installing head (40) are included.</p> |
申请公布号 |
KR20130122911(A) |
申请公布日期 |
2013.11.11 |
申请号 |
KR20130040948 |
申请日期 |
2013.04.15 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
HIGASHIZAWA YOSHITADA;KOBAYASHI KOSUKE;HATAYAMA YUKINORI |
分类号 |
H01L21/50;H01L21/60 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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