| 摘要 |
<p>The present invention provides a method to control a printing pressure on a substrate. The method comprises performing a first printing operation on a first substrate with a printing apparatus disposed relative to a first print shuttle, which has a substrate supporting surface disposed at a first position, wherein the first printing operation is performed at a first printing pressure. The method further includes performing a second printing operation on a second substrate disposed on a substrate supporting surface of a second print shuttle using the printing apparatus, wherein the second printing operation is performed when the substrate supporting surface is disposed at a second position and at a second printing pressure. If a deviation is detected between the first and second printing pressures, the position of the printing apparatus relative to the second position is changed to match the second printing pressure to the first printing pressure.</p> |
