| 摘要 |
The predetermined space is formed due to the insulating layer formed around the conductive pad of the substrate. The bump formed in the flip- chip is induced to the predetermined space. Therefore, the bump of the flip-chip and conductive pad of the top of the substrate can be accurately arranged and the exact electrical contact between the flip- chip and substrate can be made. The flip chip package comprises a flip- chip including the metal wiring and the bump(11) connected to the metal wiring(10), the substrate in which the conductive pad(21) connected to the terminal is formed in the surface within the cavity(22)(20), having a cavity. The bump of the flip-chip can be bonded to the conductive pad of substrate in the arranged state by the cavity. The underfill resin layer is formed on the top of the cavity including the flip-chip. |
