发明名称 METHOD FOR PREPARING BOARD FOR WITH 3D PATTERN
摘要 The present invention relates to a method for manufacturing a board having a 3D pattern. More specifically, the method according to the present invention comprises the following steps: (S1) attaching a finishing material to one surface of a board, for pretreatment; (S2) coating an adhesive on the finished surface of the board to form an adhesive layer thereon; (S3) printing a pattern to be formed on the adhesive layer by using a UV curable paint containing a silicon based resin; (S4) curing the pattern-printed board; (S5) top-coating a UV curable paint on the board for building materials, which is cured in step (S4); and (S6) curing the top-coated board for building materials. The board manufactured by the method according to the present invention is usable for building, furniture, and interior decoration. [Reference numerals] (S1) Step of attaching a finishing material;(S2) Step of forming an adhesive layer;(S3) Step of printing a pattern;(S4,S6) Step of curing;(S5) Step of top-coating
申请公布号 KR101324840(B1) 申请公布日期 2013.11.08
申请号 KR20130105824 申请日期 2013.09.04
申请人 DO, SUK LEE 发明人 DO, SUK LEE
分类号 B27M1/08;B27K5/00;B27M3/18 主分类号 B27M1/08
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