| 摘要 |
The present invention relates to a wafer chip grinding method and, more particularly, to the wafer chip grinding method capable of grinding each chip by using a grinding device after separating a wafer chip to reduce the thickness of the chip. The wafer chip grinding method according to the present invention comprises the steps of: 1) displaying a saw mark on the opposite side of a wafer pattern; 2) attaching a first back grinding tape and a second back grinding tape to the wafer pattern; 3) cutting the wafer, the first back grinding tape, and a part of the second back grinding tape, and separating the chip and the first back grinding tape from the cut wafer; 4) grinding the opposite side of the pattern of the separated chip; and 5) removing the first back grinding tape from the ground chip. [Reference numerals] (AA) Move from the pre-process;(BB) Move to the post-process;(S310) Step for displaying a mark on the opposite side of a wafer pattern;(S320) Step for attaching a first back grinding tape and a second back grinding tape to the wafer pattern;(S330) Step for cutting a wafer and a back grinding tape and separating a chip;(S340) Step for grinding a chip;(S350) Step for removing the back grinding tape |
