BUMP STRUCTURE, SEMICONDUCTOR PACKAGE HAVING THE BUMP STRUCTURE, AND METHOD OF FORMING THE BUMP STRUCTURE

摘要

A bump structure includes a first bump and a second bump. The first bump is disposed on a connection pad of a substrate. The first bump includes a lower portion having a first width, a middle portion having a second width smaller than the first width, and an upper portion having a third width greater than the second width. The second bump is disposed on the upper portion of the first bump.