TRANSPARENT THROUGH - GLASS CONDUCTIVE VIA IN A TRANSPARENT SUBSTRATE

摘要

This disclosure provides systems, methods and apparatus for transparent conductive vias in a transparent substrate. In one aspect, a transparent conductive via extends through a transparent substrate and electrically connects a topside conductor on a top surface of the transparent substrate and a bottom side conductor on a bottom surface of the transparent substrate. In another aspect, a transparent conductive via extends at least partially through a transparent substrate and is in electrical communication with a topside conductor on a top surface of the transparent substrate. In another aspect, a method of forming a transparent through-substrate via is provided.