发明名称 |
MANUFACTURING METHOD OF CALORIFIC PAD AND THEREBY HEATING SEAT |
摘要 |
Disclosed is a method for manufacturing a calorific pad using a surface heating element and a heating seat thereby. The method for manufacturing the calorific pad using the surface heating element according to the present invention a step for preparing a first substrate by forming a haze on one side of a first film type substrate, coating an adhesive organic solvent on the one side of a first film type substrate, and printing an electrode; a step for preparing a second substrate by forming a haze on one side of a second film type substrate, coating the adhesive organic solvent on the one side of a first film type substrate, and printing the surface heating element; and a step for bonding the first substrate to the second substrate. The surface heating element includes a step for bonding a functional group to a carbon material in an acidic solution by performing a ultrasonic process; a step for pulverizing the carbon material by dispersing the carbon material having the functional group by performing the ultrasonic process to constantly induce the direction of a current flowing through the dispersed carbon material; and a step for mixing the pulverized carbon material with a high molecular compound. According to the present invention, the method for manufacturing the calorific pad improves heat efficiency and reduces the change of resistance. [Reference numerals] (S110) Step where a haze is formed on one side of a first film-type substrate;(S130) Step where an adhesive organic solvent is sprayed on one side of the first film-type substrate;(S150) Step where an electrode is printed on one side of the first film-type substrate;(S310) Step where the haze is formed on one side of a second film-type substrate;(S330) Step where the adhesive organic solvent is formed on one side of the second film-type substrate;(S350) Step where a flocculent heat-emitting element is printed on one side of the second film-type substrate;(S400) Step where a heat-emitting pad is produced by bonding the first substrate and the second substrate |
申请公布号 |
KR20130122327(A) |
申请公布日期 |
2013.11.07 |
申请号 |
KR20120045572 |
申请日期 |
2012.04.30 |
申请人 |
DAYOU SMART ALUMINIUM CO., LTD.;DAYOU A-TECH CO., LTD. |
发明人 |
NOH, DONG HWAN;PARK, HYEON KI;PARK, YOUNG WOO |
分类号 |
H05B3/20 |
主分类号 |
H05B3/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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