| 摘要 |
PURPOSE: A substrate punching device is provided to punch a substrate by correcting the distance between the substrate and a mold and the position of the substrate. CONSTITUTION: A substrate punching device comprises a base frame (100), a substrate transfer unit (200), a punching mold, a lifting unit (400), a rotating unit, and a mold transfer unit (600). The lifting unit lifts up the punching mold, and the punching mold rotates around a vertical rotary shaft. The rotating unit is installed on the lifting unit and rotates the punching mold. The mold transfer unit has a Y-axis transfer unit (620) and a support frame (610). The Y-axis transfer unit transfers the lifting unit in a Y-axis direction. The support frame supports the Y-axis transfer unit to the base frame. |
