| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of improving bondability between a sensor section and a semiconductor substrate while suppressing characteristic abnormalities of a sensor; and a method for manufacturing the same.SOLUTION: In a region surrounding a recess 66 in one surface 61 of a semiconductor substrate 63, a region being a boundary with the recess 66 is a boundary section 61a and a region surrounding the boundary section 61a is a bounding region 61b. In this case, the area of the bonding region 61b is larger than the one of the boundary section 61a, and the bonding region 61b in the one surface 61 of the semiconductor substrate 63 is bonded to a sensor section 10 via an insulating film 64. |
