| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC module preventing the generation of a solder bridge, having excellent productivity, and capable of easily keeping quality.SOLUTION: An IC module 1 includes: a body 2; a lead terminal 3 projecting out from a surface of the body; and a holding portion 4b provided on the body, electrically connected to the lead terminal in the inside of the body, and holding a wire rod 5 of another electric component. The IC module 1 has the holding portion for holding the wire rod of another electric component, so that soldering work is not required. Therefore, the IC module 1 can prevent the generation of a solder bridge, have excellent productivity, and easily keep quality. The holding portion may be structured to elastically grip the wire rod of another electric component. In the body, a hole 2a is bored on an upper surface, and the holding portion can be equipped with at least one pair of gripping claws 4c stored in the inside of the hole and made from metallic material. The plurality of holding portions can be arranged in parallel on the upper surface of the body of the IC module. |
