| 摘要 |
PROBLEM TO BE SOLVED: To improve the throughput of a joining device.SOLUTION: A substrate joining device overlaps multiple substrates and joins the multiple substrates. The substrate joining device includes: a pressurizing part pressurizing the multiple substrate holders holding the multiple substrates while heating the multiple substrate holders; and a temperature control part equalizing thermal distribution of the substrate holders which are carried out from the pressurizing part and release the substrates held by themselves in a shorter time compared to a case that the substrate holders are left. The temperature control part may use a gaseous refrigerant. The substrate joining device may further include a cooling chamber cooling the substrate holders that are carried out from the pressurizing part holding the substrates. The cooling chamber may use a liquid refrigerant. |
