发明名称 |
SEALANT FOR SEMICONDUCTOR LIGHT-EMITTING ELEMENT, CURED FILM USING THE SAME, AND SEMICONDUCTOR LIGHT-EMITTING DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a sealant for a semiconductor light-emitting device which has viscosity and temperature characteristics that can achieve desired dispersion state of phosphor in a cured film and good production suitability that are requested in use application of the semiconductor light-emitting device, and to provide a semiconductor light-emitting device using the same.SOLUTION: A sealant for a semiconductor light-emitting element is a thermosetting sealant forming a cured film covering at least a part of the semiconductor light-emitting element. The sealant contains acrylate monomer having an average molecular weight (in terms of polystyrene) of 1,000 or less as a curable compound. A viscosity &eegr;at 25°C before curing of the sealant is 1,000 mPa sec or more and 1,000,000 mPa sec or less. A ratio &eegr;/&eegr;with a viscosity &eegr;at 50°C is 10 or more. |
申请公布号 |
JP2013229538(A) |
申请公布日期 |
2013.11.07 |
申请号 |
JP20120114330 |
申请日期 |
2012.05.18 |
申请人 |
FUJIFILM CORP |
发明人 |
KOITO NAOKI;IKEDA MORIHITO;MOROOKA NAOYUKI;TOKUOKA SHINSUKE |
分类号 |
H01L33/56;C08F20/10;C08F20/34;C08F30/02;C09K3/10;H01L21/56;H01L23/29;H01L23/31 |
主分类号 |
H01L33/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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