发明名称 SEALANT FOR SEMICONDUCTOR LIGHT-EMITTING ELEMENT, CURED FILM USING THE SAME, AND SEMICONDUCTOR LIGHT-EMITTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a sealant for a semiconductor light-emitting device which has viscosity and temperature characteristics that can achieve desired dispersion state of phosphor in a cured film and good production suitability that are requested in use application of the semiconductor light-emitting device, and to provide a semiconductor light-emitting device using the same.SOLUTION: A sealant for a semiconductor light-emitting element is a thermosetting sealant forming a cured film covering at least a part of the semiconductor light-emitting element. The sealant contains acrylate monomer having an average molecular weight (in terms of polystyrene) of 1,000 or less as a curable compound. A viscosity &eegr;at 25°C before curing of the sealant is 1,000 mPa sec or more and 1,000,000 mPa sec or less. A ratio &eegr;/&eegr;with a viscosity &eegr;at 50°C is 10 or more.
申请公布号 JP2013229538(A) 申请公布日期 2013.11.07
申请号 JP20120114330 申请日期 2012.05.18
申请人 FUJIFILM CORP 发明人 KOITO NAOKI;IKEDA MORIHITO;MOROOKA NAOYUKI;TOKUOKA SHINSUKE
分类号 H01L33/56;C08F20/10;C08F20/34;C08F30/02;C09K3/10;H01L21/56;H01L23/29;H01L23/31 主分类号 H01L33/56
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