| 摘要 |
PROBLEM TO BE SOLVED: To provide a Cu-Ni-Si based copper alloy which is excellent in strength, conductivity and coefficient of bending deflection.SOLUTION: A Cu-Ni-Si based copper alloy contains, by mass, 1.2-4.5% Ni and 0.25-1.0% Si and the balance Cu with inevitable impurities. When an X-ray diffraction intensity for a {111} plane in the rolled surface of an alloy is expressed by I{111} and an X-ray diffraction intensity for the {111} plane of a pure copper powder reference sample is expressed by I{111}, I{111}/I{111} is ≥0.15. When an X-ray diffraction intensity for a {200} plane in the rolled surface is expressed by I{200} and an X-ray diffraction intensity for the {200} plane of the pure copper powder reference sample is expressed by I{200}, I{200}/I{200} is ≤0.5. When an X-ray diffraction intensity for a {220} plane in the rolled surface is expressed by I{220} and an X-ray diffraction intensity for a {311} plane in the rolled surface is expressed by I{311}, I{111}/(I{111}+I{200}+I{220}+I{311}) is ≥0.2. In the alloy, the coefficient of bending deflection in a direction perpendicular to a rolling direction is ≥130 GPa, an yield strength YS in the direction perpendicular to the rolling direction satisfies YS≥-22×(Ni mass%)+215×(Ni mass%)+422, and conductivity in the direction perpendicular to the rolling direction is ≥30% IACS. |
