| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring circuit board in which the influence of lead wires for plating on the waveform of an electric signal is reduced, and a method for manufacturing the same.SOLUTION: A wiring pattern 20 is formed on a base insulating layer. An electrode pad 30 is provided at a part of the wiring pattern 20. A lead wire Sb for plating is formed on the base insulating layer so as to extend from the wiring pattern 20. The lead wire Sb for plating includes linear parts S3 and S4. The linear part S3 is provided so as to extend from the wiring pattern 20 and has a width H5. The linear part S4 is provided so as to extend from the linear part S3 and has a width H6 smaller than the width H5. |
