| 发明名称 |
RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
Disclosed herein is a rigid-flexible substrate including: a rigid area including a circuit layer; a flexible area formed at one end of the rigid area; and a raw material formed over the flexible area and having indentation formed on a surface thereof. |
| 申请公布号 |
US2013292164(A1) |
申请公布日期 |
2013.11.07 |
| 申请号 |
US201313870850 |
申请日期 |
2013.04.25 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
PARK JUNG YONG;JUNG MYEONG HUI;JOUNG JAE WOO;YOU DAE HYUNG |
| 分类号 |
H05K3/10;H05K1/18 |
主分类号 |
H05K3/10 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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