| 摘要 |
A microphone package in the present invention consists of a PCB substrate on which a MEMS microchip and an ASIC chip are mounted and a metal case in which an accommodation space for protecting parts connected to and mounted on the PCB substrate includes: an acoustic hole formed on one surface of the metal case; and a superhydrophobic micromesh for protecting insertion of foreign substances through the acoustic hole. Also, a microphone for protecting water or dust and et cetera is able to be manufactured by attaching a superhydrophobic micromesh to a hole in which a sound passes through. Also, moisture is not able to intrude into a connection terminal by packaging a superhydrophobic micromesh to a connection terminal part for transmitting and receiving an electrical signal with the outside. Also, a microphone package of which mesh surface is cleaned when raining since a water drop is formed on the surface of a superhydrophobic micromesh and is cleaned away with the dust on the mesh surface. Also, a noise measurement device using a low cost microphone capable of measuring noise in a location such as highway, national road, road in the city and et cetera by applying a superhydrophobic micromesh to a microphone package attached to a hole in which a sound passes through. |
