| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component built-in substrate which efficiently radiates heat generated in a semiconductor chip without using a specialized heat sink and a special resin.SOLUTION: An electronic component built-in substrate 1 includes: a lamination body G where multiple insulation layers (a resin substrate 20 and a resin layer 21) and multiple wiring layers L1, L2 respectively including wiring patterns are alternately laminated; a semiconductor chip 10 placed on a surface of the lamination body G so that its rear surface 10b contacts with the lamination body G; and a first via conductor TV which penetrates through the lamination body G to contact with the rear surface 10b of the semiconductor chip 10 and contacts with the wiring patterns PL, GL respectively included in the wiring layers L1, L2. |
