发明名称 THERMALLY-CURABLE HEAT-CONDUCTIVE SILICONE GREASE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a thermally-curable heat-conductive silicone grease composition which has high shape retention characteristics even in an early stage when the viscosity of the composition is low (the composition is easily applied), and which becomes soft (having low hardness) after being cured.SOLUTION: A thermally-curable heat-conductive silicone grease composition includes: (A) an organopolysiloxane having viscosity of 100 to 100,000 mPa s at 25°C and containing at least one alkenyl group per molecule; (B) an organopolysiloxane represented by general formula (1); (C) an organohydrogenpolysiloxane containing at least two hydrogen atoms each directly bound to a silicon atom per molecule; (D) a catalyst selected from a group consisting of platinum and platinum compounds; (F) a heat-conductive filler having heat conductivity of 10 W/m °C or more; and (G) silica fine powder, as essential components.
申请公布号 JP2013227374(A) 申请公布日期 2013.11.07
申请号 JP20120098765 申请日期 2012.04.24
申请人 SHIN-ETSU CHEMICAL CO LTD 发明人 MATSUMOTO NOBUAKI;YAMADA KUNIHIRO;TSUJI KENICHI
分类号 C08L83/07;C08K3/36;C08K9/06;C08L83/05;C08L83/06 主分类号 C08L83/07
代理机构 代理人
主权项
地址