| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board having a good connection reliability, capable of preventing surely coming-off of a via.SOLUTION: A multilayer wiring board 10 has a build-up structure formed of a plurality of resin insulation layers 33 alternately laminated with a plurality of conductor layers 42, thereby forming a multi-layer. The resin insulation layer 33 contains a glass cloth 51 in an inner layer of resin insulation material 50. A via hole 43 is formed on the resin insulation material 50 of the resin insulation layer 33, and a through hole 52 is formed on a position corresponding to the via hole 43 in the glass cloth 51. A part to be an open edge of the through hole 52 on the glass cloth 51, inwardly projects from an inner wall of the via hole 43 and bites into a side part of a via conductor 44. A weld part 58 is formed on a tip of a glass fiber 57 projecting from the inner wall 54 of the via hole 43 by welding and connecting the glass fiber 57. |
