| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroplating method which can suppress corrosion of a metal frit which makes electrical contact with an emitter layer of a semiconductor substrate.SOLUTION: A method comprises: providing a semiconductor substrate comprising a front side, a metalized back side, and a PN junction, the front side comprising a conductive pattern comprising fired metal paste; depositing a barrier layer on the conductive pattern; and bringing the semiconductor into contact with a copper plating bath which comprises one or more sources of copper ions, one or more sources of chloride ions and bromide ions, one or more sources of nitrate ions, sulfate ions and bisulfate ions and has a pH of 1.5-4, thereby applying copper layer plating onto the barrier layer on the fired metal paste of the conductive pattern. |
