发明名称 TRENCH POWER MOSFET AND FABRICATION METHOD THEREOF
摘要 An exemplary embodiment of the present disclosure illustrates a trench power MOSFET which includes a base, a plurality of first trenches, and a plurality of second trenches. The base has an active region and a termination region, wherein the termination region surrounds the active region. The plurality of first trenches is disposed in the active region. The plurality of second trenches is disposed in the termination region, wherein the second trenches extend outward from the active region side. The second trenches have isolation layers and conductive material deposited inside, in which the isolation layers are respectively disposed in the inner surface of the second trenches. The disclosed trench power MOSFET having the second trenches disposed in the termination region can increase the breakdown voltage thereof while minimize the termination region area thereby reduce the associated manufacturing cost.
申请公布号 US2013292761(A1) 申请公布日期 2013.11.07
申请号 US201213572093 申请日期 2012.08.10
申请人 YEH CHUN YING;LEE YUAN MING;GREAT POWER SEMICONDUCTOR CORP. 发明人 YEH CHUN YING;LEE YUAN MING
分类号 H01L29/78;H01L21/762 主分类号 H01L29/78
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