发明名称 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
摘要 A MOSFET includes: a substrate; a gate insulating film; a gate electrode; an interlayer insulating film formed on the gate insulating film to surround the gate electrode; a buffer film containing Ti and N and containing no Al; and a source electrode containing Ti, Al, and Si. In the MOSFET, a contact hole is formed away from the gate electrode so as to extend through the interlayer insulating film and expose a main surface of the substrate. The buffer film is formed in contact with a side wall surface of the contact hole. The source electrode is formed on and in contact with the buffer film and the main surface of the substrate exposed by forming the contact hole.
申请公布号 US2013292703(A1) 申请公布日期 2013.11.07
申请号 US201313856950 申请日期 2013.04.04
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD.;RENESAS ELECTRONICS CORPORATION 发明人 HORII TAKU;KIMURA SHINJI;KIMOTO MITSUO
分类号 H01L21/768;H01L21/28;H01L29/78 主分类号 H01L21/768
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