| 摘要 |
The disclosure discloses an adhesive tape cutting apparatus. The apparatus includes a feeding roller configured to feed an adhesive tape, a guide plate configured to contact and guide a surface of the other side end of the adhesive tape, a movable blade configured to advance from the adhesive layer and cut the adhesive tape, disposed below the guide plate so that a blade edge of the movable plate vertically faces the guide plate, a travel mechanism for causing the movable blade to travel along the tape width direction along the guide plate, and a movable blade support device configured to support the movable blade with respect to the travel mechanism in the manner that the movable blade slopes so that the blade edge presses the adhesive tape to the guide plate in the travel direction along the tape width. |
