BONDING APPARATUS FOR SEMICONDUCTOR DEVICE AND PREDICTION METHOD FOR BONDING ERROR DETECTION USING THE SAME

摘要

The present invention provides semiconductor device bonding apparatus and a bonding defect prediction method using the same. To this end, the present invention comprises a bonding head part providing heat; a thermocouple part directly sensing the heat of the bonding head part; and a bonding control part controlling the operation of the bonding head part. The bonding control part stops the bonding operation of a semiconductor die if a temperature profile as an hourly temperature value sensed in the thermocouple part is not matched with a predetermined temperature profile. Disclosed are the semiconductor device bonding apparatus and the bonding defect prediction method using the same. [Reference numerals] (110) Heat release part;(121) Temperature control part;(122) Pressure control part;(123) Head driving part;(131) Bonding part;(132) Data storage unit;(133) Temperature comparison part;(134) Alarming part;(135) Power blocking part;(136) Control part