发明名称 |
LED LIGHT SOURCE AND MANUFACTURING METHOD OF THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To solve a problem that when a contact angle of a resin end part is made close to 90 degrees for forming a transparent sealing resin into a shape close to a sphere with an LED chip located at the center thereof in an LED light source where the LED chip is mounted on a wiring board and the transparent sealing resin is dropped to seal the LED chip, it is necessary to significantly increase the viscosity of the resin and thus it takes a long time to drop the resin.SOLUTION: An LED light source 101 includes: an LED chip 1 mounted on a mounting surface 4a of a substrate 4; a ring member 3 disposed on the mounting surface 4a with a space formed between the mounting surface 4a and its outer periphery 3d so that the LED chip 1 is positioned in a circular through hole 3c; and a sealing resin 2 sealing the LED chip 1 so as not to protrude to the mounting surface 4 located at the outer side relative to the outer periphery 3d of the ring member 3 on the front surface side of the ring member 3 that includes a region of the through hole 3c. |
申请公布号 |
JP2013229397(A) |
申请公布日期 |
2013.11.07 |
申请号 |
JP20120099091 |
申请日期 |
2012.04.24 |
申请人 |
MITSUBISHI ELECTRIC CORP;MITSUBISHI ELECTRIC LIGHTING CORP |
发明人 |
NAKAO TAKAYUKI;YONEDA TOSHIYUKI;SAWADA JUNPEI |
分类号 |
H01L33/54;H01L33/60 |
主分类号 |
H01L33/54 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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