| 发明名称 |
METHOD FOR THE WAFER-LEVEL INTEGRATION OF SHAPE MEMORY ALLOY WIRES |
| 摘要 |
The present invention relates to a method to attach a shape memory alloy wire to a substrate, where the wire is mechanically attached into a 3D structure on the substrate. The present invention also relates to a device comprising a shape memory alloy wire attached to a substrate, where the wire is mechanically attached into a 3D structure on the substrate.
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| 申请公布号 |
US2013292856(A1) |
申请公布日期 |
2013.11.07 |
| 申请号 |
US201113885257 |
申请日期 |
2011.11.22 |
| 申请人 |
BRAUN STEFAN;NIKLAUS FRANK;FISCHER ANDREAS;GRADIN HENRIK;SENSEAIR AB |
发明人 |
BRAUN STEFAN;NIKLAUS FRANK;FISCHER ANDREAS;GRADIN HENRIK |
| 分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
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