发明名称 LIGHT EMITTING DEVICE CHIP SCALE PACKAGE
摘要 The substrate that is used to support the growth of the LED structure is used to support the creation of a superstructure above the LED structure. The superstructure is preferably created as a series of layers, including conductive elements that forma conductive path from the LED structure to the top of the superstructure, as well as providing structural support to the light emitting device. The structure is subsequently inverted, such that the superstructure becomes the carrier substrate for the LED structure, and the original substrate is thinned or removed. The structure is created using materials that facilitate electrical conduction and insulation, as well as thermal conduction and dissipation.
申请公布号 US2013292716(A1) 申请公布日期 2013.11.07
申请号 US201113997673 申请日期 2011.12.29
申请人 STEIGERWALD DANIEL ALEXANDER;KONINKLIJKE PHILIPS N.V. 发明人 STEIGERWALD DANIEL ALEXANDER
分类号 H01L33/08;H01L33/50 主分类号 H01L33/08
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