发明名称 ETCH BIAS HOMOGENIZATION
摘要 Methods and memory devices formed using etch bias homogenization are provided. One example method of forming a memory device using etch bias homogenization includes forming conductive material at respective levels over a substrate. Each respective level of conductive material is electrically coupled to corresponding circuitry on the substrate during patterning of the respective level of conductive material so that each respective level of conductive material has a homogenized etch bias during patterning thereof. Each respective level of conductive material electrically coupled to corresponding circuitry on the substrate is patterned.
申请公布号 US2013292633(A1) 申请公布日期 2013.11.07
申请号 US201213463245 申请日期 2012.05.03
申请人 PELLIZZER FABIO;CASTRO HERNAN A.;FLORES EDDIE T.;MICRON TECHNOLOGY, INC. 发明人 PELLIZZER FABIO;CASTRO HERNAN A.;FLORES EDDIE T.
分类号 H01L45/00;H01L21/82;H01L21/8239 主分类号 H01L45/00
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