PACKAGED MEMORY DIES THAT SHARE A CHIP SELECT LINE
摘要
<p>An apparatus includes a memory module, and the memory module includes a package. The package contains memory dies, and the memory dies share a chip select line.</p>
申请公布号
WO2013165387(A1)
申请公布日期
2013.11.07
申请号
WO2012US35914
申请日期
2012.05.01
申请人
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.;CARPENTER, DAVID G.;HALLOWELL, WILLIAM C.;BACCHUS, REZA M.
发明人
CARPENTER, DAVID G.;HALLOWELL, WILLIAM C.;BACCHUS, REZA M.
