发明名称 HEAT CONDUCTIVE FOAM SHEET FOR ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a heat conductive foam sheet for an electronic apparatus having thinness and flexibility which can be suitably used for an inner part of an electronic apparatus, and good thermal conductivity and good dielectric characteristic.SOLUTION: A heat conductive foam sheet for an electronic apparatus contains a heat conductor in an elastomer resin part forming the foam sheet, a content of the heat conductor to 100 pts.mass of the elastomer resin is 100 to 500 pts.mass, 25% compressive strength of the foam sheet is equal to or less than 200 kPa, a dielectric constant of the foam sheet is equal to or less than 4, and its thickness is 0.05 to 1 mm.
申请公布号 JP2013229591(A) 申请公布日期 2013.11.07
申请号 JP20130070420 申请日期 2013.03.28
申请人 SEKISUI CHEM CO LTD 发明人 KATO TETSUHIRO;SHIMONISHI KOJI;KURINO YUKINORI
分类号 H01L23/373 主分类号 H01L23/373
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