| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem in which, when a lead width of a lead is equivalent to a line width, no fillet with enough bonding strength is formed at a lead lateral face part, and when the lead width is smaller than the line width, high-frequency performance of a microwave module is deteriorated.SOLUTION: According to one embodiment, provided is a connection structure for a microwave circuit having: a microstrip line 14 having a ground conductor 11, a dielectric body 12 on this ground conductor 11, and a line conductor 13 on this dielectric body 12; a lead 17 having a lead piece 15 soldered to the line conductor 13, and a lead base 16 having a lead width equivalent to or larger than a conductor width of the line conductor 13; a fillet 18 formed on the line conductor 13 along a circumferential edge of a planar shape of the lead piece 15 of the lead 17; and a microwave component 20 having a microwave circuit 19 electrically connected to the lead base 16 of the lead 17 bonded and fixed by the fillet 18. |
