发明名称 |
Contactless Wafer Probing with Improved Power Supply |
摘要 |
Some embodiments relate to an integrated circuit. The integrated circuit includes an inductive or capacitive wireless communication structure located on a die region of the integrated circuit. This wireless communication structure is configured to wirelessly receive a test stimulus vector to test circuitry on the die region. The integrated circuit also includes a landing region having a size and location suitable to allow a conductive needle or conductive probe to come into direct physical and electrical contact with the landing region. The landing region provides a DC power supply to the circuitry on the die region while the test stimulus vector is wirelessly received. |
申请公布号 |
US2013293253(A1) |
申请公布日期 |
2013.11.07 |
申请号 |
US201213465142 |
申请日期 |
2012.05.07 |
申请人 |
KUO YUNG-HSIN;HUANG PO-YI;TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
KUO YUNG-HSIN;HUANG PO-YI |
分类号 |
G01R31/302;H01L23/58 |
主分类号 |
G01R31/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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