| 摘要 |
PROBLEM TO BE SOLVED: To provide a lamination structure including a resin insulation layer exhibiting high adhesion and insulation reliability to a substrate, and to provide a dry film for use therein.SOLUTION: The lamination structure has a substrate 4, and a resin insulation layer consisting of a plurality of layers formed on the substrate. Out of the plurality of resin insulation layers, a layer in contact with the substrate is a resin insulation layer (A)3 containing a hardening accelerator composed of a basic compound containing N atoms. In addition to the resin insulation layer (A), a resin insulation layer (B)2 containing a hardening accelerator, which contains P atoms, is included in the lamination structure. |
