CONDUCTIVE MATERIAL, CONNECTION STRUCTURE, AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a conductive material capable of suppressing generation of voids in a connection structure when the connection structure is obtained by electrically connecting between electrodes.SOLUTION: A conductive material according to the present invention includes: a curable compound having an unsaturated double bond; a curable compound having an epoxy group; a thermal cation curing initiator; a thermal anion curing agent; a compound capable of capturing cations generated from the thermal cation curing initiator; and conductive particles 5.