METALIZATION RESIN FILM AND MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a metalization resin film which enhances workability of fine wiring.SOLUTION: In the metalization resin film composed of a resin film substrate 1, an underlying metal layer 2 composed of a nickel alloy formed on the surface of the resin film substrate 1 with no adhesive interposed therebetween, and a metal laminate 4 consisting of a copper layer formed on the surface thereof, the ratio (OR/OR) of crystal percentage ORin the 111 orientation to crystal percentage ORin the 001 orientation of a crystal included in a thickness range down to 0.4 μm from the resin film substrate surface in the metal laminate measured by electron beam backscatter diffraction method is 7 or less.