| 摘要 |
A high-frequency module includes a switch IC and a matching circuit. The high-frequency module includes a multilayer body. The switch IC and an inductor of the matching circuit are mounted on a top surface of the multilayer body. A top-surface land electrode on which a common terminal of the switch IC is mounted is connected to one end of a wiring conductor through a via-conductor. The other end of the wiring conductor is connected to a top-surface land electrode on which a terminal electrode at one end of the inductor is mounted, through a via-conductor. An end portion of the inductor on the side connected to the common terminal of the switch IC is disposed near the common terminal. Thus, the length of the wiring conductor is shortened and a parasitic capacitance is decreased. |
