| 摘要 |
The embodiment of the present invention is to provide an apparatus for treating a substrate using a process gas and a control plate with the same. The apparatus for treating a substrate include a chamber providing a space for performing a process, a support member supporting the substrate in the chamber, a gas supply member supplying a process gas to the substrate on the support member, an exhaust assembly purging the gas from the chamber. The exhaust assembly includes an exhaust pipe connected to the chamber, an exhaust member proving a vacuum pressure in the exhaust pipe, a valve controlling the opening rate of the exhaust pipe, and a control plate with a shielding plate in the chamber to interfere the flow of a process gas in the chamber in a direction corresponding to a opening region when a part of the exhaust pipe is opened. Therefore, the process gas is uniformly supplied to the substrate. |
