| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic apparatus whose thermal resistance can be reduced, and a method of manufacturing the same.SOLUTION: The electronic apparatus according to an embodiment includes: a first conductive member; a first junction layer which contains an intermetallic compound of at least one metal selected from the group consisting of copper (Cu), silver (Ag), palladium (Pd), and platinum (Pt) and at least one metal selected from the group consisting of tin (Sn), zinc (Zn), and indium (In) and is provided on the first conductive member; a first junction support layer which is provided on the first junction layer and contains at least one metal selected from the group consisting of copper (Cu), silver (Ag), palladium (Pd), and platinum (Pt); a second conductive member provided on the first junction support layer; and an electronic component provided on the second conductive member. |
