| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive substrate having a wiring layer of low electric resistance, which is difficult to increase.SOLUTION: In a conductive substrate 10 having a lamination structure where a transparent conductive layer 13 and a wiring layer 14 are laminated, in this order, on a transparent substrate 11, the wiring layer 14 has a wiring body 15 principally comprising copper, and a first coating layer 16 principally comprising an alloy containing copper and nickel, and covering a main surface on the side opposite from the transparent substrate 11 of the wiring body 15. Nickel content of the first coating layer 16 is 30-70 wt%. |
