| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition which can be suitably used for preparation of a semiconductor device, particularly, an adhesive composition which hardly causes voids between bumps at bonding, hardly causes positional divergence of bumps, and hardly causes voids after completion of solder bonding.SOLUTION: An adhesive composition includes: a polymer (A) having a reactive functional group; a thermosetting resin (B); and a compound having flux activity (C). The composition has a minimum melt viscosity of less than 500 Pa s, with the temperature giving the minimum melt viscosity being lower than 200°C, and a melt viscosity at 200°C of 500 Pa s or more. |
