发明名称 IN-MOLD MOLDING DEVICE
摘要 PROBLEM TO BE SOLVED: To perform in-molding while preventing breakage of a decorative film.SOLUTION: An in-mold molding device includes: a supply device that supplies a decorative film between a movable-side die 11 and a fixed-side die 12; a clamp 13 that fixes the decorative film 14 to the movable-side die 11; a hot air supply device that jets hot air from the movable-side die 11 to the decorative film 14; a suction device that sucks air between the movable-side die 11 and the decorative film 14 via a suction path formed in the movable-side die 11, and brings the decorative film 14 into close contact with the movable-side die 11; and an outlet that is formed in the fixed-side die 12 and supplies synthetic resin between the decorative film 14 and the fixed-side die 12.
申请公布号 JP2013226681(A) 申请公布日期 2013.11.07
申请号 JP20120099469 申请日期 2012.04.25
申请人 PANASONIC CORP 发明人 UMEDA AKIHIRO;SHIMIZU KENZO;OKABE KIYOSHI;ABE TOSHIHARU
分类号 B29C45/16;B29C45/26 主分类号 B29C45/16
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