| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic circuit board, wherein: bonding strength of a ceramic substrate and a metal substrate is high; and thermal conductivity is high.SOLUTION: A resin is used as an organic binder contained in the brazing paste. In the resin, as shown in Fig.2 being the result of thermal gravimetric analysis (TGA) of polypropylene carbonate as an example of the organic binder, when carrying out thermal gravimetric analysis in the air at temperature rising speed of 10°C/min, the temperature of a point B where weight becomes 10% if initial weight is 100% is lower than a melting point of metal brazing powder by 400 to 500°C, and weight reducing rate from a point A where weight becomes 90% if the initial weight is 100% to a point B where weight becomes 10% is 0.6 to 4.5%/°C. |
