发明名称 SUBSTRATE TREATMENT DEVICE
摘要 PROBLEM TO BE SOLVED: To realize a substrate surely being mounted in an opening, that is a scooping port, formed by guiding surfaces of a guide part, while reducing as much as possible the height of the guide part whose inner surface becomes a guiding surface to guide the outer peripheral end surface of the substrate to position the substrate.SOLUTION: Disclosed is a substrate treatment device, comprising a chuck body including a guide part 34b whose guiding surface 36b guides the outer peripheral end surface of a substrate to position the substrate when the peripheral portion of the substrate is mounted on a substrate loading part 32. The guiding surface 36b comprises: a first guiding surface 52a for guiding the outer peripheral end surface of the substrate descending due to its own weight when the substrate is held to be loaded on the substrate loading part 32; and a second guiding surface 52b for guiding the outer peripheral end surface of the substrate that is moving while being in contact with chuck claws, when the peripheral part of the substrate is sandwiched between the substrate loading part and the chuck claws while the chuck claws are rotated in a direction closing inwardly.
申请公布号 JP2013229409(A) 申请公布日期 2013.11.07
申请号 JP20120099340 申请日期 2012.04.25
申请人 EBARA CORP 发明人 OGAWA TAKAHIRO;NAKANO HISAJIRO
分类号 H01L21/683 主分类号 H01L21/683
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