| 摘要 |
PROBLEM TO BE SOLVED: To provide a dielectric film in which connection of adjacent division layers can be prevented and pressure resistance can be improved.SOLUTION: In lamination structures 15 in which multicomponent high dielectric thin films 11 and division layers 13 are repeatedly laminated, the lamination structure 15 is constituted by a structure in which the division layer 13 is sandwiched by two barrier layers 12, 14. When manufacturing a dielectric film 1, even if post heat treatment at high temperature is performed, the lamination structure 15 constituted by the multicomponent high dielectric thin film 11 and the division layer 13 keeps a function, and the multicomponent high dielectric thin film 11 remains in the state in which it is divided by the division layer 13 in a horizontal direction. Therefore, it is possible to prevent connection of adjacent division layers 13 and improve pressure resistance. |
